On Thursday, August 25, 2016 at 9:16:12 AM UTC-6, Quadibloc wrote:
Unlike Lead Telluride, another material with a greater hole mobility than silicon has successfully been made into CMOS digital circuitry:
http://phys.org/news/2014-12-germanium-silicon-cmos-devices.html
I bumped into that article again, and noticed that the researchers had only just
discovered how to make N-type transistors in Germanium. So it isn't a mature technology.
On the other hand, Gallium Arsenide has been successfully used to build microprocessors. But it's a material with _lower_ hole mobility than silicon, so, now that microprocessors are at feature sizes where CMOS, as opposed to, say, ECL, is the only choice for thermal reasons... it's not really worth considering.
Today, silicon chips have up to a billion transistors. However, while it is true
that any new material is at a disadvantage, to be competitive, an alternative material would have to be developed to the point where a single die could contain on the order of 5.5 million transistors - the number on the CPU die of the Pentium Pro.
Gallium Arsenide had a higher rate of defects than silicon, and so chips had to be smaller. And, as noted, it isn't really too useful now.
Indium Antimonide has a very impressive electron mobility - but, again, the hole
mobility is not as good as that of silicon, so while it's excellent for very high speed circuits with only a few transistors, for a modern general-purpose microprocessor, it doesn't seem to be useful either.
Something with hole mobility too - Germanium or Lead Telluride - is what is needed. But both of those materials are in their infancy - while Lead Telluride is used for thermoelectric solid-state devices, transistor action has only recently been demonstrated in it.
Indeed, it looks like we'll have to be content with silicon for some time yet.
John Savard
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